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Zuken USA announces cloud hosted Project Management for E3.series

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Zuken USA, Inc. has added cloud-based project management to its popular E3.series suite of products for wire harness and electrical cabinet design. Cloud Collaborator for E3.series is a plug-in that connects to Amazon Web Services and Microsoft Azure for project storage and management. Companies of all sizes can now take advantage of the convenience and security of cloud storage while using the E3.series design suite.

Cloud Collaborator for E3.series works with all E3.series design modules in single-user mode, including E3.schematic, E3.cable, E3.panel, E3.formboard, and more. The new plug-in also supports specialized modules such as Harness Builder for E3.series.

Enhanced user experience
Cloud Collaborator for E3.series is easy to set up and use with Amazon Web Services and Microsoft Azure. Users can also directly connect to the Zuken Americas Community for quick access to articles, how-to videos, and user forums. The intuitive administrative options provide configurable settings for user password change, application theme color, iteration saving, language, version increment type, and more. Commercial cloud services provide on-demand scalability, robust security, and unmatched flexibility.

Easy project configuration
The Cloud Collaborator for E3.series desktop application provides robust project management for the entire team while reducing the administrative overheads typically associated with vaulting and access control solutions. Quickly add users, create groups, define user access privileges, set passwords, and define theme color and version increment type for E3.series projects.

Powerful data management
Enjoy powerful data management with the convenience and security of cloud storage. Complete design data check-in and check-out directly from E3.series. Cloud Collaborator for E3.series provides change history and the ability to compare versions, helping users visualize all changes in a clear, graphical representation. A release process is available to close the project for manufacturing when the project is complete.

Team design collaboration
Team design collaboration is more critical than ever. Cloud Collaborator for E3.series provides design data access across the E3.series project team. For better communication, project team members can access redlining, project status, and team messaging. Project changes can trigger an automated message or an email to stakeholders, keeping everyone updated. When the project is ready for review, users can generate PDFs for redlining and collaboration across the team.

Zuken USA, Inc.
www.zuken.com,

ITI launches the latest release of CADfix PPS 4

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Global interoperability solution provider International TechneGroup Incorporated (ITI), is pleased to announce the release of CADfix PPS 4, the latest version of its CAD model simplification and file size reduction software. CADfix PPS helps plant and process, power industry, marine and offshore engineers achieve up to 80% reduction in engineering design labor and costs associated with CAD model simplification.

CADfix PPS 4 sees advances in all areas of the product with a focus on enabling users to simplify large equipment assembly models more effectively. Highlights include improved and faster automatic model simplification with new Smart Deconstruction technology, extensive new manual simplification tools, and updated CAD interfaces.

CADfix PPS intelligent automatic deconstruction and simplification of complex CAD assemblies.

The CADfix PPS automatic simplification Wizard has been given a significant overhaul. A new Smart Deconstruction feature automatically splits complex or pre-joined solids into simplified primitive pieces, enabling a greater level of simplification than was previously possible. The box and cylinder simplification tool has been extended with a new conical primitive option. The hole, protrusion, and internal detail removal features are all faster and can handle more complex cases. The result is a robust and fully automatic CADfix PPS model simplification process that maintains the balance between processing time, file size reduction, and retaining the appropriate level of detail.

CADfix PPS 4 also adds the ability to automatically identify complex extrusions and convert them into simplified extruded profiles, with options to control the level of detail retained. This has a major impact on reducing file size for models containing a high number of structural members.

Complex extrusion simplification.

Lettering and logos are a frequent source of excess data in mechanical CAD models that is not required in plant design systems. ITI has implemented a new tool that identifies raised, sunken and flat lettering or logos and automatically removes them, producing significant file size savings.

CADfix PPS 4 includes a new utility to automatically create assembly structures, allowing further processing time and file size reductions. CADfix PPS 4 can quickly identify repeated parts, remove duplications, and then automatically create a new assembly structure using instances of the primary part.

As with every new release, the CAD import and export interfaces are updated with enhancements to the standard STEP, DWG, Parasolid and SAT interfaces, plus updates to support the latest native CAD formats.

“The power of CADfix PPS is in its ability to rapidly simplify large equipment models for integration into plant design systems, where productivity improvements make a real difference”, commented Andy Chinn, Director at ITI. “The latest version will deliver further time and cost savings for our customers, helping them achieve even greater time to market reductions in a very competitive industrial environment.”

ITI, a Wipro company
www.iti-global.com

Wipro Limited
www.wipro.com

COMSOL releases Version 6.1 of COMSOL Multiphysics

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COMSOL announced the release of the latest version of its modeling and simulation software, COMSOL Multiphysics version 6.1. Every aspect of the software’s simulation environment — from the ability to perform multiphysics analyses to the functionality for creating apps — delivers feature additions and workflow enhancements.

“This version provides our users with powerful multiphysics simulation tools in areas of highly competitive R&D, like audio technology and vehicle electrification,” says Bjorn Sjodin, VP of product management at COMSOL. “We have also strengthened the software’s foundation with new capabilities for optimization and the modeling of turbulent flow and mechanical contact.”

Fluid and mechanical simulations
This release brings major upgrades to the fluid flow and mechanical simulation products. The CFD Module now includes high-fidelity turbulent flow with detached eddy simulation (DES). This yields the accuracy of large eddy simulation (LES) with substantially less computational effort. A new and fast method for mechanical contact is included in the Structural Mechanics Module and the MEMS Module. It introduces new functionality for solids, shells, and membranes with full support for self-contacting surfaces. There is a new method for assigning materials to thin structures that makes it easier to analyze gaskets, adhesive layers, and claddings.

Structural analysis in version 6.1 using the new method for mechanical contact. The visualization shows the stress and deformation in the two metal tubes.

Transducer design for audio products
Version 6.1 further expands the software’s capabilities for modeling speakers and microphones in consumer electronics with additional functionality for thermoviscous acoustics. “We have a large and growing community of users among leading developers of audio technology. They use our software to analyze everything from smartphone speakers to earbuds and hearing aids. The functionality in this release completes the Acoustics Module simulation environment for analyzing electrovibroacoustics of microtransducers and microacoustic systems,” says Mads Herring Jensen, acoustics technology manager at COMSOL.

A visualization of the radiated intensity from a microspeaker in a smartphone. This simulation is using the new functionality for thermoviscous acoustics available in version 6.1.

Analysis tools for vehicle electrification
COMSOL continues its commitment to providing powerful simulation tools for engineers working on the electrification of vehicles. When assessing the operational reliability and safety of battery technology, users of the Battery Design Module will enjoy several important additions, including support for setting up thermal runaway propagation models. “I am excited about our new user interface for battery packs,” says Henrik Ekstrom, electrochemistry technology director at COMSOL. “It will be very practical for battery developers interested in charge–discharge dynamics and thermal management simulations.” In the AC/DC Module, new functionality for rapid layout of motor windings and magnet arrays ensures a smooth workflow for electric motor design and analysis.

An electromagnetic simulation of an electric motor. The new functionality in version 6.1 makes the workflow for analyzing electric motors fast and accurate.

Additional highlights

  • Version control of reports and CAD assemblies in the Model Manager
  • Automatic simplification of imported ECAD layouts for faster meshing and solving
  • Topology optimization with manufacturing constraints for milling
  • Multidimensional interpolation and inverse uncertainty quantification
  • Magnetohydrodynamics simulation with a library of liquid metals
  • Flowmeter analysis that includes coupled piezoelectric, structural, acoustics, and fluid flow effects
  • Simulation of acoustic streaming applications where ultrasound induces fluid motion
  • Analysis of fuel cell performance that includes effects of fuel impurities
  • Electrostatic discharge (ESD) simulation and prediction of lightning-induced damage to electronic components
  • Thermal analysis of satellites in orbit

COMSOL
www.comsol.com/product-download

 

The present and future of medical device innovation

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Medical device manufacturers are motivated to deliver groundbreaking drug delivery solutions driven by new pharmaceutical therapies and smart connected products that have the potential to transform the patient care paradigm from in-patient care to outpatient and self-administered therapies. Innovators that provide a compelling and intuitive user experience have a competitive advantage. However, medical device makers face challenges in their quests to develop innovative devices that meet regulatory requirements, achieve sustainability goals and improve patient experience and outcomes.

To address these challenges, medical device makers are leveraging computer-aided design (CAD), modeling, and simulation technologies unified on a collaborative and data-managed platform. This unified modeling and simulation (MODSIM) approach from Dassault Systèmes enables scientists, researchers, engineers and designers to collaboratively develop and evaluate pharmaceutical therapies combined with mechanical and electronic devices for optimal patient care.

MODSIM delivers full associativity between CAD and computer-aided engineering (CAE) models and connectivity with functional requirements, product designs and simulation results to ensure decision traceability. Beginning with conceptual designs, designers and engineers can collaborate across work functions on developing a device and its components tailored to delivering a specific drug therapy. They can analyze a range of physics that influence design performance, including structural analysis of components and assemblies, fluid dynamics and fluid-structure interactions of the drug delivered through the device and electromagnetic analysis of the electronic components and antennas for wireless connectivity.

Combined with design exploration, optimization and data management applications, MODSIM improves upon basic CAD and CAE integration. MODSIM enables workflow automation to eliminate laborious, repetitive and error-prone tasks such as updating simulation models and re-meshing each design revision. Best practices for modeling and simulation are easily captured, templatized and distributed to non-experts so they can reliably assess the implication of design modifications. Data management apps and the cloud platform allow them to share their simulation results and share their thinking on performance-based decisions, regardless of their physical location.

Beyond the device function itself, developers need to evaluate the physical and physiological interaction of medical devices with the human body. For instance, when developing a drug delivery device, designers can use a virtual twin of the human body, which is a dynamic virtual 3D model, to analyze the sizing and ergonomics of their device, as well as the force required to insert a needle into the skin for a variety of patient types ranging from adults to children. Similarly, cardiac implant makers can use a virtual twin of the heart to evaluate how an artificial heart valve will move during the cardiac cycle in a virtual environment before physical prototyping or testing on humans. Significant technical advances are being made in the development of realistic, validated virtual models of human organs and musculoskeletal systems to enable the assessment of medical device safety and effectiveness.

Realistic modeling and simulation of medical devices interacting with virtual humans offers the promise of creating personalized virtual twins to evaluate the individual patient experience, device safety and therapeutic outcomes.

Dassault Systèmes Life Sciences & Healthcare
www.3ds.com/industries/life-sciences-healthcare

For your Halloween fun – simulating flame in a pumpkin

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Adam Weaver, Director of Engineering, Rand Simulation

We’re getting into the spirit here at RandSim, and I thought I’d take the opportunity to play around with combustion modelling in Fluent. Though I had worked for many years in the turbomachinery CFD space, I was focused on the aero/thermal side, working either in heat transfer modelling of the cooled blades, or in the compressor/turbine aerodynamics. That is to say – upstream or downstream of the combustor, but never the combustion itself. Others on my team have done combustion modelling, so I figure I’d give it a try!

Once I dove in, I found it followed much of the familiar path of learning something new in ANSYS. I start out intimidated by what I don’t know until I crack open the user guide, put one mouse click in front of the other and soon enough I’m looking back at the end-result wondering why it took me so long to try. I thought I’d chronicle a bit of my path here, not on the specifics of combustion modelling, but more on the journey of learning a new feature in ANSYS.

First, I started where I’m very familiar, geometry modelling and meshing. I found a model file of a pumpkin online, and it imported into SpaceClaim cleanly and passed all geometry checks. It did have a removable lid, but for my purposes I didn’t need it, so I merged the bodies together. Then I cut a hole in the top, and added a cylinder in the middle to represent a candle with a small, indented surface to act as the fuel inlet. Last, I grabbed an image of our RandSIM logo and overlayed it on the pumpkin and traced out a cut in the pumpkin face.

Pumpkin geometry in SpaceClaim using image projection to cut logo

I then created an air volume around it, named all my surfaces and proceeded into Fluent meshing. From there, I used the watertight meshing workflow with Poly-Hexcore selected as the volume fill. I used mostly default settings for the mesh, with the exception of increasing the number of buffer layers to 6 to give a bit more mesh quality around where I expected a dancing flame and airflow around the pumpkin.

Mosaic Mesh of Pumpkin created using Watertight Meshing Workflow

So far, this was all familiar territory, but once I got into Fluent and was preparing to set up the combustion model, I knew I needed to get some material to reference. Luckily ANSYS has some fantastic places to find this information. The very first thing I did was select the Non-Premixed Combustion model within the Species dialog box and click the Help button. This (like the Help button in all dialog boxes) sent me directly to the relevant section in the Fluent User’s Guide, and described the meaning and use for each button or input field on this box. Furthermore, for when I need a bit more information on the mathematical models used, (such as the Diffusion Flamelet Models), I can click on those relevant links to be sent to the Fluent Theory Guide.

Example Snippet from Fluent Theory Guide

 

The user guide is really the best way to get quick info for specific setup options when working through a problem, but for my case, I was not aware of where to start and needed a bit more of a workflow demonstration. For that, I turned to the Ansys Learning Hub. I navigated to the Fluids Building and found a learning room specifically for Fluent Combustion Modelling with a few instructor-led recordings, and folders of training material with lecture slides and workshops. If I wanted to become more deeply involved in combustion, I would go through all the content there, but for now I just wanted to get a feel for the Non-Premixed combustion model, so I navigated to that folder and brought up both the lecture slides and the workshop slides. The workshop was reasonably close to my scenario (though obviously not of a pumpkin), so I was able to start there and just apply the settings they used to my problem with a few slight modifications, referencing the lecture slides whenever I needed clarification on what a setting meant.

For post processing, I created a few scene views where the flame structure itself was visualized via multiple levels of iso-surfaces around the combustion by-products. And then I just colored those with the “flame” contour type for a good visual. I set the animation to export every timestep and then saved the video file at the end.

In addition to creating a fun Halloween visual, this serves as a great case study in how easy it is to learn something new in Ansys by using the quick access available resources. The user and theory guides provide for quick reference of specific input fields and features, and the learning hub provides deeper descriptions for specific workflows and physics types. It doesn’t take long to learn something new, so feel free to experiment and let us know if you would like further information on anything you find!

 

 

Siemens launches cloud-native software for electrical design

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Siemens Digital Industries Software today announced the immediate availability of Siemens’ Capital Electra X, a new cloud-native electrical design software as a service (SaaS) offering aimed at individual electrical designers or small teams that require an affordable yet powerful electrical design solution. Part of the Siemens Xcelerator portfolio of software and services, Capital Electra X offers users sophisticated electrical design capabilities with lower cost-of-ownership and shorter time-to-productivity than traditional on-premises solutions.

“Many products across multiple industries are differentiated via increasingly sophisticated electrical content, driving rapid adoption of commercial electrical design tools,” said Frances Evans, senior vice president, Integrated Electrical Systems, Siemens Digital Industries Software. “However, individual electrical engineers or small design teams often struggle with the higher cost-of-ownership and longer time-to-productivity of more complex enterprise-focused solutions. Instead, a browser-based SaaS solution designed for ease of use, rapid adoption, and, with minimal training requirements, will enable them to create electrical schematics easier and faster, using any device, for a low monthly cost.”

 

The new Capital Electra X offering is based on pioneering technology from the recently acquired Radica Software Sdn. Bhd., based in Ipoh, Malaysia.

“As a provider of cloud-native electrical CAD, with a proven digital go-to-market model, and over 300 customers across 50 countries, the Radica Software team are proud and excited to join Siemens,” said Thomas Yip, CEO, Radica Software. “The combination of the Electra Cloud technology from Radica, bolstered by Siemens’ technology, development capacity and global reach, provides the opportunity to better serve the SMB electrical design market with the first fully cloud-native SaaS solution tailored towards individuals and small teams.”

“Siemens, with its broad and deep Capital product suite, is a leading solution provider in enterprise electrical design, especially in the automotive, aerospace and off-road vehicle industries,” said Chad Jackson, CEO and Chief Analyst, Lifecycle Insights. “Our research has shown that companies of many sizes are building out electrical design competencies to support the development of smart, connected products. With Capital Electra X, Siemens supports small and medium-sized businesses’ efforts to incorporate electrical systems into their offerings with power and ease of access. More broadly, this acquisition bolsters the entire Capital suite, allowing Siemens to serve the right solution to those working on products of any complexity and in any stage of growth.”

The Capital Electra X offering is available immediately. Further information, including pricing and capabilities, and an option for a 30-day free trial is available at siemens.com/capitalelectrax

Siemens’ acquisition of Radica Software closed on July 01, 2022. Terms of the transaction were not disclosed.

Siemens Digital Industries Software
siemens.com/capitalelectrax 

Siemens boosts collaboration and performance with Solid Edge 2023

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Siemens Digital Industries Software announced the latest release of Solid Edge software for product design, engineering and manufacturing, bringing a new streamlined user experience, greater interoperability with the Siemens Xcelerator portfolio and greater capability and collaboration across many industry workflows.

“Alongside our work to bring innovative technology and capability to each release of Solid Edge, covering everything from 3D design through advanced CAM and into technical publications, it’s key that we also evolve how we make these capabilities available to our community,” said John Miller, Senior Vice President, Mainstream Engineering Software, Siemens. “We’re now introducing new licensing options designed to better meet the changing business needs of small and medium-sized manufacturers, providing greater flexibility, more value and, with Xcelerator Share, greater collaboration and speed.”

Solid Edge’s new look and feel brings a modern update to include more intuitive ways of working, greater personalization options and improved modeling workflows. Updates to the geometry definition tools in Solid Edge include synchronous technology applied to traditional ordered history-based parts and parts created using convergent modeling (using generative design or from 3D scans) can be used in simulations without the need for additional conversion.

Solid Edge 2023 also unlocks the power of design data while future proofing customers’ work – data from Solid Edge can be transferred between other solutions in the Siemens Xcelerator portfolio, including NX Mechatronics Concept Designer (MCD) and Process Simulate. Solid Edge 2023 also leverages Siemens’ leadership in Model Based Definition (MBD), with a new Solid Edge Advanced PMI add-on that delivers high-quality consistent dimensioning for downstream applications that can take advantage of 3D annotated product data models.

The new Solid Edge Inspector add-on brings tools to automatically identify, label, and extract critical design and manufacturing characteristics for inspection and metrology purposes, automatically generates high-quality inspection data and reports that facilitate communication in downstream manufacturing processes.

New advanced manufacturing capabilities include new Roughing for 5-Axis Machining in Solid Edge CAM Pro, a new 4-axis Rotary Machining add-on and new wire EDM functionality. For those working at the leading edge of machining, the new Smart Machine Kits library provides easy access to standardized, professionally built machine simulation kits, enabling machinists to get up and running with full machine simulation in a fraction of the time typically needed.

Also introduced with Solid Edge 2023, Solid Edge SaaS brings value-based licensing combined with cloud-connected, anywhere access through Xcelerator Share. The new flexible licensing option available through a Solid Edge SaaS subscription allows capabilities to be added when needed, providing access to integrated add-ons for generative design, point cloud visualization, electrical routing, PCB collaboration, advanced simulation and much more. All of these can be easily mixed and matched with a flexible token system.

Meanwhile, product engineering data can be stored securely in the cloud and easily shared by teams and wider value chain, anywhere, anytime, on any device using Xcelerator Share. Augmented Reality (AR) capabilities can be used to see that same data in the context of the real world.

Learn more about the updates to Solid Edge at siemens.com/solidedge2023

Siemens Digital Industries Software

A look at how others work with Multiphysics

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COMSOL, the provider of the COMSOL Multiphysics simulation software, announced the 2022 edition of COMSOL News—its annual magazine that recognizes the work of academic and industry organizations around the world that use multiphysics simulation to drive innovative technological research and development.

Within the magazine, readers will find examples of how simulation enables teams to make more informed design decisions, speed up development, reduce physical testing, and minimize costs. Readers will also gain insight into the COMSOL Multiphysics user experience across a variety of applications and simulation-based product development, design optimization, and research.

This magazine highlights the following topics and organizations:
• A “digital twin” for climate management in an additive manufacturing facility — MTC, U.K.
• Analyzing the ice loss of Greenland’s glaciers — Alfred Wegener Institute, Germany
• Drivetrain components for electric vehicles — Bosch, Germany
• Electric vehicle battery management system design — Exicom Tele-Systems, India
• Removal of micropollutants from wastewater — Eden Tech, France
• RF-induced heating of implanted medical devices in MRI systems — MED Institute, U.S.
• Sand “batteries” to store solar-generated heat — Polar Night Energy, Finland
• Silicon photonic MEMS phase shifters for fiber optic networks — EPFL, Switzerland
• Virtual design and prototyping of subsea cables — Hellenic Cables, Greece

Comsol
www.comsol.com

Tech Soft 3D launches CEETRON Toolkits to support CAE workflow

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Tech Soft 3D, a provider of engineering software development toolkits, announces a new line of toolkits designed to fully support computer-aided engineering (CAE) workflows. Comprising four components, the CEETRON suite of solutions enables software engineers to accelerate CAE application development at every stage of the process. The new toolkits bring together technology from Ceetron AS, Visual Kinematics (VKI) and Tech Soft 3D to provide the industry’s first complete platform for pre-processing, solving, and post-processing of CAE data, giving customers such as ANSYS, Elise GmBH, DNV, SimScale and nTopology one strategic partner to work with for their CAE applications.

“Bringing together the technologies acquired in 2020 to create a complete suite of CAE toolkits that connects with HOOPS and Polygonica is not only very exciting for us, but is also in line with our mission to empower our customers to create the most sophisticated applications and products using powerful, integrated and easy- to- use component technologies,” said Ron Fritz, CEO of Tech Soft 3D. “It has been especially rewarding to see the results of our successful acquisitions, not only from a product standpoint, but also to see our teams so well integrated and working towards the same goal. This is a milestone for our company, and we anticipate that our customers will be very happy with these new tools and the ability to relate to a single partner for all their CAE technology needs.”

CAE workflows are unique
Throughout a typical CAE workflow, each step requires specific technologies, where the use of market-hardened toolkits is highly beneficial. When looking at the setup stage, HOOPS Exchange is the market’s best-in-class data access component, capable of bringing into play geometry from 30+ CAD formats. In many cases, the design needs healing prior to meshing: Polygonica is the ideal component to prepare tessellations for CAE. The CEETRON toolkit line takes the relay at that point, with CEETRON Mesh yielding both 2D and 3D meshes adapted to simulation purposes. When it comes to the calculations themselves, the CEETRON Solve SDK is an extensive framework to formulate finite element equations, assemble them into a global system, and eventually solve them through high-performance parallel (SMP) linear algebra.

The workflow ends with the analysis and sharing of the solver’s results analyzed by the expert eye of an engineer. With CEETRON Envision, Tech Soft 3D provides a palette of technologies to handle data extraction, display model generation, optimized rendering on desktop and native web, as well as data sharing and reporting.

Finally, the CAE workflow is also supported by general purpose technologies such as visualization, interoperability and automation. The new CEETRON Toolkits provide off-the-shelf solutions for each of these to help CAE developers reduce their development and workflow building efforts.

Few SDKs are as friendly as the CEETRON Toolkits and provide such a high level of development efficiency. With the same lines of code, developers can achieve reading capability of 30+ industry standard CAE formats and are able to write out 10+ formats to convey results to other packages. Last but not least, the toolkits are developed and supported by a highly responsive team of experienced developers.

Ceetron Envision
Ceetron Envision is the industry’s first all-in-one CAE analysis and visualization platform that provides a complete framework specialized in CAE data analysis and visualization. It includes data processing, rendering, automation and sharing, and is available for both browser-based web applications and more classical desktop ones. Envision allows developers to seamlessly dig into the large CAE datasets produced by solvers and provide interactive and automated analysis tools for expert engineering. Mechanical engineers can also share their analysis work through a wide variety of visualization outputs: HTML files, AR/VR headsets, Microsoft documents, interactive PPTs, etc. .

Key features of Ceetron Envision include:

High-speed extraction tools
CPU and memory-optimized CAE data management
Cutting planes, isosurfaces, isovolumes, particle traces
Animations
Length and history plots
Powerful and easy-to-develop APIs
Shader-based OpenGL and WebGL
Desktop and in-browser apps
Universal display model sharing format
Lightweight storage of key interactive models with results
Enhanced engineering efficiency
Embeddable interactive models for websites, Word, PPT, HTML

Ceetron Access
Ceetron Access provides the interoperability necessary to open closed simulation applications to the global CAE ecosystem. Through a unified access to nearly all CAE files formats, Ceetron Access is a key building block for CAE interconnections and therefore, workflows. Unlike other SDKs, Ceetron Access does not try to force data into a particular paradigm, it simply reads data from the native file and stores it in memory in a universal model that can be interrogated.

Key features of Ceetron Access include:

Import of 30+ of the most popular CAE formats: Ansys, Abaqus, Nastran, Hypermesh, Fluent, openFoam, etc.
Export to 10+ standard CAE formats
High performance with efficient memory usage

Ceetron Mesh
Ceetron Mesh works on conforming tessellations to deliver fail-free automatic mesh generations. It provides meshes in 2D and 3D with control on mesh size, geometric precision and element quality. The surface mesher generates triangles and quads, and the volume mesher provides tetrahedrons and mixed pyramid/hex meshes. Furthermore, both parabolic and cubic elements can be generated. The Ceetron Mesh SDK provides a complete set of control options for mesh size – both isotropic and anisotropic – as well as for element quality. Finally, the toolkit is delivered with source code to illustrate how it can be interfaced to popular geometry kernels such as Siemens Parasolid, Spatial ACIS and OpenCASCADE. Along the same lines, a bridge to HOOPS Exchange further expands the range of CAD input formats.

Key features of Ceetron Mesh include:

Broad element support
Extensive set of control options
CAD integrations with Parasolid, ACIS, OpenCASCADE and all formats supported by HOOPS Exchange

Ceetron Solve
Ceetron Solve is a high-performance platform for building finite element method (FEM) solvers. Its components allow defining element-level contributions, and handle global assembly as well as linear solving. It allows developers to model at element level and obtain FEM contributions of a given element and includes a built-in library of material models. In addition, the toolkit tackles the assembly of the local matrix and vector contributions, as well as the pure math needed for linear system and eigenvalue problem solving. The toolkits are built on a high level of coarse-grained data distribution on shared-memory parallel architectures, and the algorithms are continuously benchmarked on real-life simulations and optimized for memory and CPU to remain ahead of the competition.

Key features of Ceetron Solve include:

Local physics: Define physical models at element level and obtain FEM contributions of the element
Global solving: Equation system assembly, linear equation solving and eigenvalue problem resolution
High level of coarse-grained SMP, including efficient out-of-core solving, best-in-class iterative and direct solvers and a high-speed AMLS eigensolver

The Ceetron Toolkits provide an unmatched ability to fetch and process data to provide insight to engineers – the key of a successful CAE analysis environment. Tech Soft 3D’s tools are known for their performance, both in terms of execution, speed and low memory consumption, and the Ceetron Toolkits maintain the power and flexibility required for CAE workflows.

“Our teams have spent the past 25+ years developing and proving these toolkits to align with the needs of our customers and the market,” added Fritz. “We are proud to be able to offer our customers rock-solid and high-performing solutions to enable rapid, robust development of CAE applications and workflows.”

The Ceetron Toolkits are the culmination of technologies from Ceetron and VKI, which Tech Soft 3D acquired in 2020.

Tech Soft 3D
www.techsoft3d.com

PTC introduces Onshape-Arena connection for product development and supply chain collaboration

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PTC announced the availability of the Onshape-Arena Connection, a new functionality that connects its cloud-native Onshape product development and Arena product lifecycle management (PLM) solutions. The Connection enables product data to be shared instantly between the Onshape and Arena solutions with the click of a button, helping companies to accelerate the product development process and simplify collaboration with supply chain partners.

“The Onshape-Arena Connection is the next step on PTC’s journey to make the product development process faster, easier, and more agile for designers, engineers, and suppliers, and it’s only possible because of the cloud-native architectures of Onshape and Arena,” said Jon Hirschtick, General Manager of Onshape at PTC. “This is product development from a single provider with CAD, PDM, and PLM workflows fully realized in the cloud.”

The Onshape-Arena Connection supports continuous, cross-functional product development that can significantly reduce costs and schedule impacts on the manufacturing process. With the Connection, all stakeholders in the product development process – including design engineering, quality, procurement, and supply chain partners – are always working on the same version of a design. This allows for design reviews at any time and improvements to the product before investments are made in expensive manufacturing lines and tooling.

“The Onshape-Arena Connection can reduce the friction, high costs, and coding that typically occur when trying to connect product data management and product lifecycle management systems,” said Felix Alvarez Rivera, Chief Product Officer of Wavemaker Labs, Inc. “This functionality makes it easier for product data to flow from engineering to operations, including supply chain partners.”

The Connection requires zero downloads, installs, or administration time and comes at no additional cost to Onshape and Arena users.

PTC
www.ptc.com

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