Patrick Curran, Author at 3D CAD World

Engineers can accelerate product development time and more accurately predict in-flight icing to improve aircraft safety thanks to advancements ANSYS (NASDAQ: ANSS) has delivered with two new product releases. The most recent release of ANSYS® SpaceClaim™ and ANSYS® FENSAP™ dramatically enhances speed, efficiency and reliability – providing users with revolutionary workflows and unique capabilities.

As companies turn to rapid digitalization for every facet of product development, the ability to easily manipulate geometry for both design and manufacturing is crucial. ANSYS SpaceClaim 2016 transforms product development by empowering users to quickly and easily manipulate 3-D models across the entire product development cycle. SpaceClaim’s unique approach delivers superior ease of use and productivity, providing the user with extreme flexibility within product workflows.

“Since day one, our focus has been to provide customers with a solution to quickly create, edit or repair geometries as needed in an open platform environment,” said Frank DeSimone, senior director of product development at ANSYS. “For this release, we focused on solving challenges working with complex geometry, developing new tools like the Shrinkwrap and Skin Surface to decrease the time needed to reverse-engineer parts or prepare models for 3-D printing.”

Whether creating designs, editing, cleaning geometries from other tools or reverse engineering existing products, SpaceClaim leapfrogs previous releases by delivering unprecedented results such as 10-times faster 3-D modeling compared to other products on the market. Start-up time is two to four times improved; large model save and load stages are 100 times their former speed; and some tools, such as imprint, result in a 200-times speed improvement. From machinist to simulation analyst, existing users will see vast improvements and users of other tools will be amazed by the novel approach to geometry.

A list of new and enhanced features can be found here. http://s3.amazonaws.com/images.spaceclaim.com/RSIMG/SPC+2016+Fact+Sheet_PRINT-FNL.pdf

Aerospace engineers who analyze aircraft icing can take immediate advantage of the comprehensive state-of-the-art capabilities with FENSAP-ICE and FENSAP-ICE Turbo. The new release — the first since ANSYS acquired this technology – provides improved integration with ANSYS CFX software, its class-leading turbomachinery fluid dynamics simulation software. The enhanced integration enables users to take advantage of the unique capabilities of FENSAP-ICE and FENSAP-ICE TURBO to optimize designs and improve safety by more accurately predicting ice formation in jet engines.

The new release adds numerous enhancements for users of these two systems, enabling them to predict in-flight icing for aircraft, engines, probes and components more efficiently and accurately. The FENSAP product family incorporates speed-up and efficiency gains, enabling the user to incorporate icing prediction in their simulation-driven product development processes.

“The new release delivers streamlined import and export of required data for more efficient and accurate exchange between the FENSAP products and ANSYS computational fluid dynamics solutions,” said Andre Bakker, senior director of fluids business unit, ANSYS. “Maximizing the accuracy of icing simulation ensures that the engineering insight gained from analysis and the resulting design decisions made truly serve to improve flight safety.”

The FENSAP release also includes a number of enhancements and extensions that further efficiency, including more flexible meshing options, faster solution algorithms, direct extraction of key simulation results and more powerful post-processing. These contribute to reducing the time and effort required to investigate and solve complex questions associated with icing.

A list of new and enhanced features can be found here. http://www.ansys.com/Products/Fluids/ANSYS+FENSAP-ICE

ANSYS, Inc.
www.ansys.com

Mentor Graphics Corporation (NASDAQ: MENT) announce the newest version of its FloTHERM® product. The FloTHERM product was developed to quickly identify potential thermal issues early in the design process to avoid expensive late stage re-design and warranty costs arising from thermal failures in the field. The newest version of the FloTHERM product delivers an automated method to calibrate simulation models to match transient thermal measurements recorded with the Mentor Graphics® T3Ster® hardware. As a result, the FloTHERM product can help maximize simulation data accuracy and provide additional insight into product reliability – a necessity for the automotive, aerospace and electronics products industries.

Mentor Graphics T3Ster product is an advanced thermal tester for thermal characterization of IC packages, LEDs and systems which produces extensive thermal characteristics rapidly. The industry-leading T3Ster test system delivers highly accurate, real-time measurements of heating and cooling transients based on its advanced implementation of the JEDEC static test method (JESD51-1) and can now be considered to be 10X better than alternative solutions.

The new FloTHERM product can convert a simulated transient thermal response into a structure function curve using the same mathematical process utilized by the T3Ster product. These structure function curves are known to correlate with the physical structure of the device, and are thus the ideal platform to compare simulation with test data. Differences between the structure functions indicate that some aspect of the simulation model is incorrect; typically dimensions or physical properties that are difficult to measure directly such as thermal interface material (TIM) thicknesses or interfacial thermal contact resistances. The new FloTHERM version uses optimization methods to change the model inputs and drive the simulation structure function towards the experimental structure function until a match is achieved. This match indicates that the FloTHERM model is fully calibrated and will respond correctly and accurately in any transient application. Package manufacturers can now certify supply chain models, by providing evidence about the thermal performance of the component in customer applications along with the model itself.

Additional features in the new FloTHERM product include:
• Joule heating – DC electrical calculations are now supported for joule heating effects to be accurately predicted, enabling power distribution net analysis and bus bar design to be performed.

• FloMCAD Bridge enhancement – 64-bit support enables larger MCAD designs to be imported into the FloTHERM product. In addition, the voxelization method used to translate MCAD geometry into analysis objects was re-engineered to be 20 times faster and much smarter, ensuring that coincident faces on different bodies maintain that connection after translation.

• Localized grid spaces – overlapping localized spaces can now be created. The FloTHERM product makes it easy to construct an efficient grid for large cluttered geometry because the arrangement of localized grid spaces is no longer a concern.

• DCIM Software Development Kit – The kit includes everything a DCIM supplier needs to drive FloTHERM, capture the simulation results, and display them within their DCIM software suite. “Mentor Graphics’ DCIM Software Development Kit provides all the hooks DCIM firms like us need to integrate FloTHERM with software such as FieldView 2015™ with ease. This enables us to drive FloTHERM from within our software suite and display the results, including the way shown in the Excel-based example” added Dr. Fredrick Dirla, Jr, CEO of Fieldview Solutions. “I applaud Mentor for democratizing CFD for data center simulation and eliminating guess-work.”

Mentor Graphics Corporation
www.mentor.com/products/mechanical/flotherm/