Siemensdigitalindustriessoftware

Siemens Digital Industries Software announced the latest update to Siemens’ Simcenter 3D software, part of Siemens’ Xcelerator portfolio of software and services. Among the new capabilities, Simcenter 3D offers increased support for turbomachinery modeling, a dedicated drop test application for handheld devices, tightly integrated topology optimization with the NX Design environment, and a new acoustic solution method that is up to 10 times faster than standard methods.

Siemens’ Simcenter 3D 2022.1 release focuses on helping engineers overcome challenges in four key areas:

Model the complexity: The ability to model and understand complex physical phenomena is at the forefront of this release. Simcenter 3D’s industry-leading solution for the turbomachinery industry has been extended with additional thermal multiphysics, rotordynamics and thermal fatigue capabilities to more accurately capture the complex physics happening within these machines. A new dedicated set of tools to simulate spiral bevel gears, as often found in automotive differentials, enables accurate, system-level NVH analysis on these mechanisms to reduce gear whine. Additionally, a new dedicated application simplifies and streamlines the drop-test simulation process for electronic and other handheld devices for engineers who are not simulation experts.

Explore the possibilities: Acoustics auralization capabilities allow engineers to not only simulate but also listen to the acoustics/sound within the context of the end-user’s experience. Engineers can now mix all contributing sounds and listen to the combined acoustics results to answer questions such as “What will a loudspeaker sound like when you put it in a car and combine it with background noise from the engine, HVAC, wind and road?” In this release, topology optimization is now more tightly integrated with the NX Design environment so that simulations are ‘replayable’ and become easier for designers to create lightweight, yet structurally capable designs.

Go faster: Two core updates enable our customers to break new ground more quickly than ever before. The new high-performance boundary element method with adaptive order solution (BEMAO) used for acoustics simulation is up to 10 times faster compared to the standard boundary element method, while new load case filtering for aerostructures allows engineers to quickly determine the final critical list of load cases from the thousands of load cases experienced in an airframe.

Stay integrated: Simcenter 3D now connects with Xcelerator Share for Xcelerator as a Service (or XaaS) subscribers. The Xcelerator Share collaborative cloud environment helps users or distributed workgroups seamlessly share files and communicate results to aid ad-hoc collaboration. Finally, engineers can now launch simulations remotely to any workstation or HPC cluster right from their desktop.

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Siemens Digital Industries Software announced the establishment of JEP181—a neutral file, XML-based standard from the JEDEC Solid State Technology Association, which is the global leader in standards development for the microelectronics industry. The JEP181 standard simplifies thermal model data sharing between suppliers and end-users in a single file format called ECXML (Electronics Cooling eXtensible Markup Language).

The new standard was created to meet a significant challenge for electronics manufacturers: as increasingly powerful processors allow companies to pack more performance and functionality into their designs, the effective management of heat dissipation and other thermal factors has become essential to the successful design of their next-generation electronics products. Advanced electronics cooling simulation technologies enable the creation of highly accurate thermal models of new product designs. But the absence of a uniform format for the exchange of thermal simulation data throughout supply chains has created unnecessary duplication of effort and the potential introduction of errors into the stream.

Proposed through the JEDEC JC15 committee, the new JEDEC JEP181 standard simplifies thermal model data sharing. With this universal thermal model sharing standard, electronics manufacturers can reduce the time required to simulate and validate their thermal models.

“The JEP181 standard from JEDEC benefits thermal design engineers by providing wider availability of the key data necessary to validate the thermal performance of today’s advanced designs,” stated Ghislain Kaiser, senior director, Intel Corp. “This standardized format will allow more interoperability between engineering teams, leading to substantial time and cost savings by removing design barriers previously common in thermal engineering.”

Thermal model data availability and sharing is one of the key limiting factors in capitalizing on the benefits of thermal simulation throughout the product design process. Countless hours spent on mining product data sheets for thermal information, or re-implementing 2D engineering drawings within thermal simulation tools, can now be replaced by seamlessly importing commercial 3D simulation tools from software suppliers. The JEP181 standard is ideal for emerging technologies and trends such as miniaturization, 2.5D and 3D semiconductor packaging, and 5G technology– all of which demand increased power dissipation density.

“As a leader in industrial software solutions, our contribution to the new JEP181 standard can help drive the digitalization of design data to reduce both time and errors for today’s innovative electronics products,” stated Jean-Claude Ercolanelli senior vice president of Simulation and Test Solutions, Siemens Digital Industries Software. “Enabling a seamless digitalized software flow can radically increase the efficiency and accuracy of thermal simulation and thus, enhance the performance and reliability of digital twin prototypes and manufactured products.”

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Siemens announced that it has acquired Nextflow Software, an independent provider of advanced particle-based computational fluid dynamics (CFD) solutions. Nextflow Software will become part of Siemens Digital Industries Software, where its offering will expand the Simcenter software portfolio, part of the Siemens’ Xcelerator portfolio of software and services, with rapid meshless CFD capabilities to accelerate the analysis of complex transient applications in the automotive, aerospace, and marine industries such as gearbox lubrication, tank sloshing or electric motor spray cooling.

“Our customers need to leverage sophisticated simulations earlier and more often in their design process, and this is creating a strong demand for rapid and automated CFD of dynamic gas-liquid flows,” said Jean-Claude Ercolanelli, Senior Vice President, Simulation and Test Solutions, Siemens Digital Industries Software. “Meshless technology has emerged as a leading solution to greatly reduce the setup and solving times for this class of problems, accelerating time to results and prove the behavior of products at a reduced time and cost.”

Siemens Digital Industries Software is already positioned strongly in the CFD market, providing both CAD-centric and high-fidelity solutions across mechanical and electrical design scenarios. The addition of Nextflow Software’s Smooth-Particle Hydrodynamics (SPH) technology into the Simcenter portfolio can enable analysts to leverage the complementary nature of meshless and mesh-based solvers to capitalize on each of their strengths, opening the door to new applications that were previously difficult to address.

“We are very excited to join Siemens and expand the scope of CFD simulation for our customers,” said Vincent Perrier, CEO of Nextflow Software “Today, there is no single validation approach that fits all industrial applications. As engineering problems become more complex and design cycles are shortened, analysts must find the optimal trade-off between accuracy and computation time. Nextflow Software’s SPH solutions nicely complement the existing CFD offering in the Simcenter Portfolio to overcome challenges of complexity and long run-times.”

Founded in 2015 and headquartered in Nantes, France, Nextflow Software is a startup company focused on the development of innovative SPH meshless CFD methods. They have played a critical role in moving SPH from academic labs into the hands of analysts across industries, helping simulate complex transient problems faster and earlier in the product development cycle.

The transaction closed on June 1, 2021. Terms were not disclosed.

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Siemens Digital Industries Software announced the latest version of Simcenter FLOEFD software, a CAD-embedded computational fluid dynamics (CFD) tool. Simcenter FLOEFD software helps users frontload CFD simulation early into the design process to understand the behavior of their concepts. It can reduce the overall simulation time by as much as 75% and it runs seamlessly inside NX software, Solid Edge software, CATIA V5 and Creo. The latest version includes new functions that let designers take advantage of a seamless working environment, as well as enhancements that extend thermal simulation capabilities and lighting applications.

Simcenter FLOEFD includes improvements within process integration, allowing design engineers to implement CFD solutions within their workflow without requiring process changes. Simcenter FLOEFD for NX projects and results can be managed in Teamcenter software. Integrations with HyperLynx software, a suite of analysis and verification software for PCB engineers, allow for enhanced thermal analysis and more accurate simulation of printed circuit boards (PCBs) by taking into account joule heating phenomena.

The latest version of Simcenter FLOEFD also includes expanded capabilities based on Simcenter MAGNET software technology to increase accuracy of thermal simulation by considering electromagnetic phenomena. Direct integration of structural analysis allows CAD-centric users to apply CFD results to perform linear structural stress analysis of complex PCBs accurately. A new interface to Simcenter Nastran software allows easy transfer of CFD results for structural analysis in Simcenter 3D software. In addition, new enhancements for lighting applications include pulse-width modulation of a light source and the simulation of scattering and photoluminescence of phosphor particles, which are used during the manufacture of LEDs.

Siemens Digital Industries Software
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